Global Extreme Ultraviolet Lithography (EUVL) Market Report 2018-2025 includes a comprehensive analysis of the present Market. The report starts with the basic Semiconductor and Electronics industry overview and then goes into each and every detail.
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Market Drivers and Restraints:
- Reduction in the complexity and cost
- Increasing trend of miniaturization
- High price of EUVL systems
- Complexity of design and infrastructure readiness.
Global Extreme Ultraviolet Lithography (EUVL) Market Segmentation:
The market is based on:-
- Light Source and
- Geographical Segments.
Based on end-user, the market is segmented into:-
- Integrated Device Manufacturer (IDM),
Based on equipment, the market is segmented into:-
- Light Source,
Based on light source, the market is segmented into:-
- Laser Produced Plasmas (LPP),
- Vacuum Sparks,
- Gas Discharge.
Based on geography, the market report covers data points for 28 countries across multiple geographies such as:-
- North America,
- South America,
- Asia-Pacific and
- Middle East & Africa.
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Global Extreme Ultraviolet Lithography (EUVL) Market is expected to reach USD 9.02 billion by 2025 from USD 1.22 billion in 2017 and is projected to grow at a CAGR of 28.14% in the forecast period of 2018 to 2025.
Extreme ultraviolet lithography (EUVL) is a next generation lithography technology that uses small wavelength to create circuits with small features and obtain better resolution output. Lithography is used to print complex patterns of semiconductor wafers defined by integrated circuit. To produce high power EUV radiation, discharge-produced plasma (DPP) and laser-produced plasma (LPP) are the noticeable technology used.
- Cannon Inc.,
- Intel Corporation,
- Nikon Corporation,
- Nuflare Technology Inc.,
- Samsung Corporation,
- SUSS Microtec AG,
- Taiwan Semiconductor Manufacturing Company Limited (Tsmc),
- Ultratech Inc.,
- Vistec Semiconductor Systems,
- Carl Zeiss,
- Toppan Printing,
- NTT Advanced Technology,
- Global foundries and Among other.
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